Semiconductor ntim tau hloov zuj zus los ntawm ib txwm 1D PCB tsim rau kev txiav-ntug 3D hybrid sib txuas ntawm qib wafer. Qhov kev nce qib no tso cai rau kev sib txuas sib txuas hauv ib tus lej micron ntau, nrog bandwidths txog li 1000 GB / s, thaum tswj kev ua haujlwm siab. Ntawm qhov tseem ceeb ntawm cov txheej txheem ntim khoom semiconductor siab heev yog 2.5D ntim (qhov twg cov khoom tau muab tso rau ntawm ib sab ntawm cov txheej txheem nruab nrab) thiab 3D ntim (uas suav nrog vertically stacking active chips). Cov thev naus laus zis no yog qhov tseem ceeb rau yav tom ntej ntawm HPC systems.
2.5D ntim tshuab suav nrog ntau yam khoom siv hauv nruab nrab, txhua tus muaj nws tus kheej qhov zoo thiab qhov tsis zoo. Silicon (Si) cov khaubncaws sab nraud povtseg, suav nrog tag nrho cov khoom siv silicon wafers thiab thaj chaw silicon txuas hniav, paub txog kev muab cov kev sib txuas zoo tshaj plaws, ua rau lawv zoo tagnrho rau kev ua haujlwm siab. Txawm li cas los xij, lawv raug nqi ntau ntawm cov khoom siv thiab kev tsim khoom thiab ntsib cov kev txwv hauv cheeb tsam ntim. Txhawm rau txo cov teeb meem no, kev siv cov choj silicon hauv zos tau nce zuj zus, siv cov tswv yim siv silicon qhov kev ua haujlwm zoo yog qhov tseem ceeb thaum hais txog thaj chaw txwv.
Organic intermediary khaubncaws sab nraud povtseg, siv kiv cua-tawm molded yas, yog ib tug nqi-zoo lwm txoj rau silicon. Lawv muaj qhov qis dielectric tas li, uas txo RC qeeb hauv pob. Txawm hais tias cov txiaj ntsig zoo li no, cov txheej txheem nruab nrab ntawm cov txheej txheem organic tau tawm tsam kom ua tiav tib theem ntawm kev sib cuam tshuam cov yam ntxwv txo qis raws li silicon-raws li ntim, txwv lawv cov kev saws me nyuam hauv kev ua haujlwm siab.
Cov iav nruab nrab cov khaubncaws sab nraud povtseg tau txais txiaj ntsig tseem ceeb, tshwj xeeb tshaj yog tom qab Intel qhov kev tshaj tawm tsis ntev los no ntawm iav-raws li lub tsheb ntim khoom. Cov iav muaj ntau qhov zoo, xws li hloov tau coefficient ntawm thermal expansion (CTE), siab ruaj khov, du thiab tiaj tus, thiab muaj peev xwm los txhawb kev tsim vaj huam sib luag, ua rau nws yog ib tus neeg sib tw rau cov txheej txheem nruab nrab uas muaj peev xwm sib piv nrog silicon. Txawm li cas los xij, ib sab ntawm cov kev sib tw, lub ntsiab drawback ntawm iav intermediary txheej yog qhov tsis paub qab hau ecosystem thiab tam sim no tsis muaj peev xwm ntau lawm. Raws li cov ecosystem loj hlob thiab muaj peev xwm ntau lawm txhim kho, iav-raws li technologies nyob rau hauv semiconductor ntim yuav pom ntxiv kev loj hlob thiab kev saws me nyuam.
Nyob rau hauv cov nqe lus ntawm 3D ntim tshuab, Cu-Cu pob-tsawg hybrid bonding yog dhau los ua cov thev naus laus zis tshiab. Cov txheej txheem qib siab no ua tiav kev sib txuas mus tas li los ntawm kev sib txuas cov khoom siv hluav taws xob (xws li SiO2) nrog cov hlau kos (Cu). Cu-Cu hybrid bonding tuaj yeem ua tiav qhov sib txawv hauv qab 10 microns, feem ntau nyob rau hauv ib tus lej micron ntau, sawv cev rau kev txhim kho tseem ceeb ntawm cov tshuab micro-bump, uas muaj qhov sib txawv ntawm li 40-50 microns. Qhov zoo ntawm hybrid bonding muaj xws li nce I / O, txhim kho bandwidth, txhim kho 3D ntsug stacking, zoo zog efficiency, thiab txo cov kab mob parasitic thiab thermal kuj vim tsis muaj cov hauv qab filling. Txawm li cas los xij, qhov kev siv tshuab no nyuaj rau kev tsim khoom thiab muaj nqi ntau dua.
2.5D thiab 3D ntim thev naus laus zis suav nrog ntau yam kev ntim khoom. Hauv 2.5D ntim, nyob ntawm qhov kev xaiv ntawm cov khoom siv nruab nrab, nws tuaj yeem muab faib ua silicon-based, organic-based, thiab iav-based intermediary txheej, raws li qhia hauv daim duab saum toj no. Hauv 3D ntim, kev txhim kho ntawm micro-bump thev naus laus zis txhawm rau txo qhov sib nrug, tab sis niaj hnub no, los ntawm kev siv hybrid bonding thev naus laus zis (txoj kev sib txuas ncaj qha Cu-Cu), ib tus lej sib nrug qhov ntev tuaj yeem ua tiav, kos cim kev nce qib hauv thaj chaw. .
**Technological Trends rau Saib:**
1. **Larger Intermediary Layer Areas:** IDTechEx yav tas los kwv yees tias vim qhov nyuaj ntawm silicon intermediary khaubncaws sab nraud povtseg ntau tshaj 3x reticle loj txwv, 2.5D silicon choj daws yuav sai sai hloov silicon intermediary khaubncaws sab nraud povtseg raws li thawj xaiv rau ntim HPC chips. TSMC yog tus xa khoom loj ntawm 2.5D silicon intermediary khaubncaws sab nraud povtseg rau NVIDIA thiab lwm yam HPC developers zoo li Google thiab Amazon, thiab lub tuam txhab tsis ntev los no tshaj tawm loj zus tau tej cov nws thawj-tiam CoWoS_L nrog ib tug 3.5x reticle loj. IDTechEx cia siab tias qhov kev sib tw no txuas ntxiv mus, nrog rau kev nce qib ntxiv tau tham hauv nws daim ntawv tshaj tawm hais txog cov players loj.
2. **Panel-Level Ntim:** Vaj huam sib luag-theem ntim tau dhau los ua qhov tseem ceeb, raws li tau hais tseg ntawm 2024 Taiwan International Semiconductor Exhibition. Txoj kev ntim khoom no tso cai rau kev siv cov txheej txheem loj dua thiab pab txo cov nqi los ntawm kev tsim cov pob ntau dua ib txhij. Txawm hais tias nws muaj peev xwm, cov kev cov nyom xws li kev tswj hwm warpage tseem yuav tsum tau daws. Nws qhov tseem ceeb nce ntxiv qhia txog qhov kev xav tau loj dua, muaj txiaj ntsig zoo ntawm cov txheej txheem nruab nrab.
3. ** Iav Intermediary Layers: ** Iav tau tawm los ua cov khoom sib tw muaj zog rau kev ua tiav cov hlua zoo, piv rau silicon, nrog cov txiaj ntsig ntxiv xws li kho CTE thiab kev ntseeg siab dua. Iav intermediary khaubncaws sab nraud povtseg kuj tau sib xws nrog lub vaj huam sib luag-theem ntim, muab lub peev xwm rau high-density thaiv ntawm tus nqi tswj tau ntau dua, ua rau nws muaj kev cog lus rau kev ntim khoom yav tom ntej.
4. **HBM Hybrid Bonding:** 3D tooj liab-tooj liab (Cu-Cu) hybrid bonding yog ib qho cuab yeej tseem ceeb rau kev ua tiav ultra-fine pitch ntsug interconnections ntawm chips. Cov tshuab no tau siv ntau yam khoom siv high-end server, suav nrog AMD EPYC rau stacked SRAM thiab CPUs, nrog rau MI300 series rau stacking CPU/GPU blocks ntawm I/O tuag. Hybrid bonding yuav tsum ua lub luag haujlwm tseem ceeb hauv kev nce qib HBM yav tom ntej, tshwj xeeb tshaj yog rau DRAM pawg tshaj 16-Hi lossis 20-Hi txheej.
5. **Co-Packaged Optical Devices (CPO):** Nrog rau qhov kev thov loj dua rau cov ntaub ntawv ntau dua thiab kev siv hluav taws xob, kev siv tshuab kho qhov muag tau txais txiaj ntsig ntau. Co-packaged optical devices (CPO) tau dhau los ua qhov kev daws teeb meem tseem ceeb rau kev txhim kho I / O bandwidth thiab txo qis kev siv hluav taws xob. Piv nrog rau cov khoom siv hluav taws xob ib txwm muaj, kev sib txuas lus kho qhov muag muaj ntau qhov zoo, nrog rau kev txo qis ntawm cov teeb liab attenuation nyob rau hauv qhov kev ncua deb, txo kev sib txuas lus rhiab heev, thiab nce bandwidth. Cov txiaj ntsig zoo no ua rau CPO qhov kev xaiv zoo tshaj plaws rau cov ntaub ntawv siv zog, lub zog siv HPC.
**Key Markets to Watch:**
Lub lag luam tseem ceeb tsav txoj kev loj hlob ntawm 2.5D thiab 3D ntim technologies yog undoubtedly lub high-performance xam (HPC) sector. Cov txheej txheem ntim qib siab no yog qhov tseem ceeb rau kev kov yeej cov kev txwv ntawm Moore Txoj Cai, ua kom muaj ntau lub transistors, nco, thiab kev sib txuas hauv ib pob. Lub decomposition ntawm chips kuj tso cai rau kev pom zoo siv cov txheej txheem ntawm cov kev ua haujlwm sib txawv, xws li cais I / O blocks los ntawm kev ua cov blocks, ntxiv dag zog rau kev ua haujlwm.
Ntxiv nrog rau kev ua haujlwm siab (HPC), lwm lub khw muag khoom kuj tseem xav kom ua tiav kev loj hlob los ntawm kev txais yuav cov khoom ntim siab heev. Hauv 5G thiab 6G sectors, kev tsim kho tshiab xws li ntim cov kav hlau txais xov thiab cov kev daws teeb meem txiav tawm yuav ua rau lub neej yav tom ntej ntawm wireless nkag network (RAN) architectures. Autonomous tsheb kuj tseem yuav tau txais txiaj ntsig, vim tias cov thev naus laus zis no txhawb nqa kev sib koom ua ke ntawm cov sensor suites thiab cov khoos phis tawj los ua cov ntaub ntawv loj thaum ua kom muaj kev nyab xeeb, kev ntseeg siab, kev cog lus, lub zog thiab kev tswj xyuas thermal, thiab kev siv nyiaj zoo.
Cov neeg siv khoom siv hluav taws xob (xws li smartphones, smartwatches, AR / VR cov khoom siv, PCs, thiab chaw ua haujlwm) tau tsom mus rau kev ua cov ntaub ntawv ntau dua hauv qhov chaw me me, txawm hais tias tseem ceeb dua rau tus nqi. Advanced semiconductor ntim yuav ua lub luag haujlwm tseem ceeb hauv cov qauv no, txawm hais tias cov txheej txheem ntim yuav txawv ntawm cov siv hauv HPC.
Post lub sij hawm: Oct-25-2024