Cov khoom ntim semiconductor tau hloov zuj zus los ntawm cov qauv tsim 1D PCB ib txwm mus rau kev txiav cov 3D hybrid bonding ntawm qib wafer. Qhov kev nce qib no tso cai rau kev sib txuas ntawm qhov sib nrug hauv ib tus lej micron, nrog rau bandwidths txog li 1000 GB / s, thaum tswj kev siv hluav taws xob zoo. Ntawm lub hauv paus ntawm cov thev naus laus zis ntim semiconductor siab heev yog 2.5D ntim (qhov twg cov khoom raug muab tso rau ib sab ntawm ib txheej nruab nrab) thiab 3D ntim (uas cuam tshuam nrog kev sib dhos ntsug). Cov thev naus laus zis no tseem ceeb rau yav tom ntej ntawm HPC systems.
Cov thev naus laus zis ntim khoom 2.5D muaj ntau yam khoom siv txheej nruab nrab, txhua tus muaj nws qhov zoo thiab qhov tsis zoo. Cov txheej nruab nrab Silicon (Si), suav nrog cov wafers silicon passive tag nrho thiab cov choj silicon hauv zos, paub txog kev muab cov peev xwm txuas hluav taws xob zoo tshaj plaws, ua rau lawv zoo tagnrho rau kev suav lej ua haujlwm siab. Txawm li cas los xij, lawv kim heev ntawm cov ntaub ntawv thiab kev tsim khoom thiab ntsib cov kev txwv hauv thaj chaw ntim khoom. Txhawm rau txo cov teeb meem no, kev siv cov choj silicon hauv zos tab tom nce ntxiv, siv silicon qhov twg kev ua haujlwm zoo yog qhov tseem ceeb thaum daws cov teeb meem thaj chaw.
Cov txheej nruab nrab organic, siv cov yas pwm uas raug kiv cua tawm, yog lwm txoj hauv kev pheej yig dua li silicon. Lawv muaj qhov dielectric tsis tu ncua qis dua, uas txo RC qeeb hauv pob khoom. Txawm hais tias muaj cov txiaj ntsig no, cov txheej nruab nrab organic tawm tsam kom ua tiav tib theem ntawm kev txo qis kev sib txuas zoo li cov ntim khoom raws li silicon, txwv lawv txoj kev siv hauv cov ntawv thov kev suav lej siab.
Cov txheej txheem iav nruab nrab tau txais kev txaus siab heev, tshwj xeeb tshaj yog tom qab Intel tsis ntev los no tso tawm cov khoom ntim khoom siv iav. Iav muaj ntau yam zoo, xws li qhov hloov kho tau coefficient ntawm thermal expansion (CTE), kev ruaj khov siab, du thiab tiaj tiaj, thiab muaj peev xwm txhawb nqa kev tsim vaj huam sib luag, ua rau nws yog tus neeg sib tw zoo rau cov txheej txheem nruab nrab nrog cov peev xwm txuas hluav taws xob sib piv rau silicon. Txawm li cas los xij, sib nrug los ntawm cov teeb meem kev siv tshuab, qhov tsis zoo tseem ceeb ntawm cov txheej txheem iav nruab nrab yog lub ecosystem tsis paub tab thiab tam sim no tsis muaj peev xwm tsim khoom loj. Thaum lub ecosystem loj hlob thiab cov peev xwm tsim khoom zoo dua, cov thev naus laus zis iav hauv kev ntim khoom semiconductor yuav pom kev loj hlob ntxiv thiab kev siv.
Hais txog kev siv tshuab ntim khoom 3D, Cu-Cu bump-less hybrid bonding tab tom dhau los ua ib qho thev naus laus zis tshiab. Cov txheej txheem siab heev no ua tiav kev sib txuas mus tas li los ntawm kev sib xyaw cov khoom siv dielectric (xws li SiO2) nrog cov hlau embedded (Cu). Cu-Cu hybrid bonding tuaj yeem ua tiav qhov sib nrug hauv qab 10 microns, feem ntau nyob rau hauv ib tus lej micron, sawv cev rau kev txhim kho tseem ceeb dua li cov thev naus laus zis micro-bump ib txwm muaj, uas muaj qhov sib nrug ntawm li 40-50 microns. Cov txiaj ntsig ntawm hybrid bonding suav nrog kev nce I / O, kev txhim kho bandwidth, kev txhim kho 3D ntsug stacking, kev siv hluav taws xob zoo dua, thiab txo cov teebmeem parasitic thiab kev tiv thaiv thermal vim tsis muaj kev sau hauv qab. Txawm li cas los xij, cov thev naus laus zis no nyuaj rau tsim thiab muaj nqi siab dua.
Cov thev naus laus zis ntim khoom 2.5D thiab 3D suav nrog ntau yam txheej txheem ntim khoom. Hauv kev ntim khoom 2.5D, nyob ntawm seb xaiv cov ntaub ntawv txheej nruab nrab, nws tuaj yeem faib ua cov txheej nruab nrab silicon, organic, thiab iav, raws li pom hauv daim duab saum toj no. Hauv kev ntim khoom 3D, kev txhim kho ntawm cov thev naus laus zis micro-bump lub hom phiaj yog kom txo qhov ntev ntawm qhov sib nrug, tab sis niaj hnub no, los ntawm kev siv cov thev naus laus zis sib txuas (txoj kev sib txuas ncaj qha Cu-Cu), qhov ntev ntawm qhov sib nrug ib tus lej tuaj yeem ua tiav, cim kev nce qib tseem ceeb hauv daim teb.
**Cov Qauv Tseem Ceeb ntawm Kev Siv Tshuab uas Yuav Tsum Tau Saib Xyuas:**
1. **Cov Cheeb Tsam Txheej Nruab Nrab Loj Dua:** IDTechEx tau kwv yees ua ntej tias vim muaj teeb meem ntawm cov txheej nruab nrab silicon uas tshaj qhov txwv loj ntawm 3x reticle, cov kev daws teeb meem choj silicon 2.5D yuav hloov cov txheej nruab nrab silicon ua qhov kev xaiv tseem ceeb rau kev ntim cov chips HPC. TSMC yog tus neeg muab khoom loj ntawm 2.5D silicon intermediary layers rau NVIDIA thiab lwm cov neeg tsim khoom HPC xws li Google thiab Amazon, thiab lub tuam txhab nyuam qhuav tshaj tawm tias nws yuav tsim ntau yam khoom ntawm nws thawj tiam CoWoS_L nrog qhov loj ntawm 3.5x reticle. IDTechEx xav tias qhov kev hloov pauv no yuav txuas ntxiv mus, nrog rau kev nce qib ntxiv uas tau tham hauv nws daim ntawv tshaj tawm uas npog cov neeg ua si loj.
2. **Ntim-Theem Vaj Huam Sib Luag:** Kev ntim khoom-theem vaj huam sib luag tau dhau los ua qhov tseem ceeb, raws li tau hais tseg ntawm 2024 Taiwan International Semiconductor Exhibition. Txoj kev ntim khoom no tso cai rau kev siv cov txheej nruab nrab loj dua thiab pab txo cov nqi los ntawm kev tsim ntau pob khoom tib lub sijhawm. Txawm hais tias nws muaj peev xwm, cov teeb meem xws li kev tswj hwm warpage tseem yuav tsum tau daws. Nws qhov kev nce qib qhia txog qhov kev thov loj hlob rau cov txheej nruab nrab loj dua, pheej yig dua.
3. **Cov Txheej Iav Nruab Nrab:** Iav tab tom tshwm sim ua cov khoom siv zoo rau kev ua tiav cov xov hlau zoo, sib piv rau silicon, nrog rau lwm yam zoo xws li CTE hloov kho tau thiab kev ntseeg siab dua. Cov txheej iav nruab nrab kuj sib xws nrog cov ntim khoom vaj huam sib luag, muab lub peev xwm rau cov xov hlau ceev ceev ntawm cov nqi tswj tau ntau dua, ua rau nws yog qhov kev daws teeb meem zoo rau cov thev naus laus zis ntim khoom yav tom ntej.
4. **HBM Hybrid Bonding:** 3D tooj liab-tooj liab (Cu-Cu) hybrid bonding yog ib qho thev naus laus zis tseem ceeb rau kev ua tiav ultra-fine pitch vertical interconnections ntawm cov chips. Cov thev naus laus zis no tau siv rau hauv ntau yam khoom siv server siab, suav nrog AMD EPYC rau stacked SRAM thiab CPUs, nrog rau MI300 series rau stacking CPU/GPU blocks ntawm I/O dies. Hybrid bonding xav tias yuav ua lub luag haujlwm tseem ceeb hauv kev nce qib HBM yav tom ntej, tshwj xeeb tshaj yog rau DRAM stacks tshaj 16-Hi lossis 20-Hi txheej.
5. **Cov Khoom Siv Optical Uas Muaj Cov Pob Khoom Ua Ke (CPO):** Nrog rau qhov kev thov kom muaj cov ntaub ntawv ntau dua thiab kev siv hluav taws xob zoo dua, cov thev naus laus zis optical interconnect tau txais kev saib xyuas ntau heev. Cov khoom siv optical uas muaj cov pob khoom ua ke (CPO) tab tom dhau los ua qhov kev daws teeb meem tseem ceeb rau kev txhim kho I/O bandwidth thiab txo kev siv hluav taws xob. Piv rau kev xa hluav taws xob ib txwm muaj, kev sib txuas lus optical muaj ntau yam zoo, suav nrog kev txo qis ntawm cov teeb liab thaum mus deb, txo qis kev nkag siab ntawm crosstalk, thiab nce bandwidth ntau heev. Cov txiaj ntsig no ua rau CPO yog qhov kev xaiv zoo tshaj plaws rau cov kab ke HPC uas siv cov ntaub ntawv ntau, siv hluav taws xob zoo.
**Cov Lag Luam Tseem Ceeb Yuav Tsum Tau Saib Xyuas:**
Lub lag luam tseem ceeb uas tsav tsheb txoj kev loj hlob ntawm 2.5D thiab 3D ntim khoom siv thev naus laus zis yog qhov tsis muaj qhov tsis ntseeg tias yog kev suav lej siab (HPC). Cov txheej txheem ntim khoom siab heev no yog qhov tseem ceeb rau kev kov yeej cov kev txwv ntawm Moore's Law, ua kom muaj ntau lub transistors, nco, thiab kev sib txuas hauv ib pob. Kev rhuav tshem cov chips kuj tso cai rau kev siv cov txheej txheem zoo tshaj plaws ntawm cov blocks ua haujlwm sib txawv, xws li kev sib cais I / O blocks ntawm cov blocks ua haujlwm, txhim kho kev ua haujlwm ntxiv.
Ntxiv rau kev suav lej siab (HPC), lwm lub lag luam kuj xav tias yuav ua tiav kev loj hlob los ntawm kev siv cov thev naus laus zis ntim khoom siab heev. Hauv 5G thiab 6G sectors, kev tsim kho tshiab xws li cov kav hlau txais xov ntim khoom thiab cov kev daws teeb meem chip tshiab yuav tsim lub neej yav tom ntej ntawm wireless access network (RAN) architectures. Cov tsheb tsav tsheb tsis siv neeg kuj yuav tau txais txiaj ntsig, vim tias cov thev naus laus zis no txhawb kev koom ua ke ntawm cov sensor suites thiab cov chav suav lej los ua cov ntaub ntawv ntau thaum ua kom muaj kev nyab xeeb, kev ntseeg siab, kev sib sau ua ke, lub zog thiab kev tswj hwm thermal, thiab kev siv nyiaj tsim nyog.
Cov khoom siv hluav taws xob rau cov neeg siv khoom (xws li cov xov tooj ntse, cov smartwatches, AR/VR devices, PCs, thiab cov chaw ua haujlwm) tab tom tsom mus rau kev ua cov ntaub ntawv ntau dua hauv qhov chaw me me, txawm tias muaj kev tsom mus rau tus nqi ntau dua. Kev ntim khoom semiconductor siab heev yuav ua lub luag haujlwm tseem ceeb hauv qhov sib txawv no, txawm hais tias cov txheej txheem ntim khoom yuav txawv ntawm cov uas siv hauv HPC.
Lub sijhawm tshaj tawm: Lub Kaum Hli-07-2024