Ntim tshuab semiconductor tau hloov zuj zus los ntawm cov tsoos 1d cov qauv tsim los txiav-ntug 3D hybrid khi ntawm qib wafer. Qhov kev nce qib no tso cai rau kev sib cav sib txawv hauv ib qho-lej micron, nrog bandwidths ntawm txog li 1000 GB / s, thaum tuav lub zog siab. Ntawm qhov tseem ceeb ntawm Advanced Syniconductor ntim tshuab hluav taws xob yog 2.5d ntim khoom (qhov twg muab tso rau ntawm ib sab nruab nrab txheej) thiab 3D ntim (uas cuam tshuam nrog cov ntxaij tseem ceeb). Cov thev naus laus zis yog qhov tseem ceeb rau yav tom ntej ntawm HPC tshuab.
2.5D Kev Siv Tshuab Ntim Ntau Tshaj Plaws suav nrog ntau yam nruab nrab nruab nrab, txhua tus nrog nws tus kheej thiab qhov tsis zoo. Silicon (Si) intermediary txheej, nrog rau kev ua kom tiav silicon wafers thiab ib cheeb tsam cua sov, ua rau lawv zoo tshaj rau kev ua haujlwm siab. Txawm li cas los xij, lawv raug nqi nyob rau hauv cov nqe lus ntawm cov ntaub ntawv thiab kev tsim khoom thiab cov kev txwv nyob hauv thaj chaw ntim khoom. Txhawm rau txo cov teeb meem no, kev siv cov kab sib txuas ua haujlwm silicon uas muaj kev ua haujlwm zoo dua yog qhov tseem ceeb thaum hais txog thaj tsam kev txwv.
Organic Intermed txheej, siv kiv cua-tawm molded plastics, yog qhov kev xaiv tau zoo ntxiv rau cov silicon. Lawv muaj ib daim dielectric qis dua, uas txo cov rc ncua hauv pob. Dua li ntawm cov kev ua tau zoo, cov organic intermars kom ua tiav cov txheej txheem sib txawv ntawm kev sib txuas lus, txwv lawv txoj kev saws me nyuam suav cov kev siv.
Iav Intermed Cov khaubncaws sab nraud pov thawj tau txais kev txaus siab tseem ceeb, tshwj xeeb yog ua raws li Intel tsis ntev los no lub tsheb nres tsheb. Iav muaj ntau qhov zoo, xws li kho tau cov coefficient ntawm thermal excitionion (CTE), siab los txhawb nqa cov khaubncaws sab nraud. Txawm li cas los xij, ib sab ntawm cov kev cov txuj ci ntawm cov txheej txheem, lub ntsiab ntawm cov iav intermedy txheej yog qhov muaj peev xwm loj heev. Raws li cov ecosystem matures thiab ntau lawm canneticts txhim kho, cov thev naus laus zis ntawm cov tshuab semiconductor yuav pom kev loj hlob ntxiv thiab kev saws me nyuam.
Hais txog thev 3D ntim tshuab, cu-cu bump-tsawg hybrid bonding yog ua ib lub thev naus laus zis ua lag luam. Qhov txheej txheem siab tshaj plaws tau ua tiav kev sib txuas ua ke tas mus li los ntawm kev sib txuas cov ntaub ntawv daelic (zoo li SIDO2) nrog cov hlau uas tau). Cu-Cu hybrid bonding tuaj yeem ua tau cov kab txuas hauv qab 10 lub microns, uas muaj ntau tus lej sib txawv ntawm cov lej micro Qhov zoo ntawm hybrid txoj hlua khi suav nrog ntau dua I / O, txhim kho kev ua kom zoo dua qub, ua kom zoo dua 3D kev cuam tshuam vim tsis muaj qhov hauv qab txhaws. Txawm li cas los xij, cov thev naus laus zis no yog cov ua lag luam thiab muaj cov nqi siab dua.
2.5D thiab 3D ntim thev naus laus zis encompass ntau cov txheej txheem ntim ntim ntau yam. Hauv 2.5d ntim, nyob ntawm qhov kev xaiv ntawm cov khoom nruab nrab ntawm cov khoom siv, nws tuaj yeem raug cov organic, raws li pom hauv daim duab saum toj no. Hauv 3D ntim, kev txhim kho ntawm micro-bump technology qhov ntev (tab sis hnub no, los ntawm kev sib txuas ntawm cov txheej txheem sib txawv ( Cov.
** Cov tswv yim tseem ceeb los saib: **
1. ** Modlary Cov Txheej Txheem: ** Idtechex yav dhau los kwv yees qhov uas muaj kev sib tw ntawm 3x tsis tshua muaj kev sib tw ua ntej TSMC yog ib qho tseem ceeb ntawm 2.5d silicon interpediary txheej zoo li Google - tiam coisos_l nrog 3.5x reticle loj. Idtechex xav kom cov qauv no txuas ntxiv, nrog nce qib ntxiv hauv nws cov lus ceeb toom npog cov neeg ua si loj.
2.. Qhov kev ntim ntim ntim no tso cai rau kev siv cov txheej txheem nruab nrab loj thiab pab txo cov nqi los ntawm kev ua ntau pob khoom sib txuas ib txhij. Txawm hais tias nws muaj peev xwm, cov kev sib tw xws li kev tswj ua warpage tseem yuav tsum tau hais. Nws txoj kev tshaj tawm nce zuj zus tau qhia txog qhov kev thov kev loj hlob rau qhov loj dua, muaj nqi ntau dua.
3. ** Iav Intermed Ua Haujlwm: ** Iav yog los ua cov khoom siv sib tw zoo, nrog cov txiaj ntsig zoo xws li CTEjustable CTEjustable CTEjustable CTiamility. Iav Intermed Cov khaubncaws sab nraud kuj tseem tau tshaj nrog cov tsheb sib luag, muab cov khoom siv hluav taws xob ntau ntxiv rau cov kev daws teeb meem ntim yav tom ntej.
4. ** HBM Hybrid Kev Ua Haujlwm: ** 3D Tooj Liab (Cu-CU) Cov thev naus laus zis no tau siv ntau yam nyob rau hauv High-End server cov khoom lag luam, suav nrog AMD EPYC rau stacking SAMPING / GPU block rau i / o tuag. Hybrid Kev Ua Haujlwm yuav tsum ua lub luag haujlwm tseem ceeb hauv HBM kev txhim kho yav tom ntej, tshwj xeeb tshaj yog rau kev ua kom zoo nkauj tshaj 16-hi lossis 20-hi txheej.
5. ** Kev siv cov khoom siv kho mob (CPO) CO-PACUAGED OCEARS (CPO) tau dhau los ua ib qho kev daws teeb meem tseem ceeb rau kev txhim kho I / O bandwidth thiab txo kev siv hluav taws xob. Piv rau cov hluav taws xob ib txwm muaj kev sib txuas lus, kev sib txuas lus kho qhov muag muaj ntau qhov zoo, suav nrog kev ncua tsheb qis dua, txo cov crostalk rhiab heev. Cov kev zoo no ua cpo txoj kev xaiv zoo tshaj plaws rau cov ntaub ntawv-intensive, lub zog-txuag HPC tshuab.
** Cov cim tseem ceeb saib: **
Lub khw lag luam tsav kev txhim kho ntawm 2.5D thiab 3D ntim thev naus laus zis yog tsis ntseeg qhov kev ua tau zoo (HPC) sector. Cov kev ntim siab tshaj plaws yog qhov tseem ceeb rau kev kov yeej cov kev txwv ntawm Moore txoj cai ntawm Moore txoj cai, ua rau muaj cov trantors, nco thiab sib txuas ntxiv. Lub decomposition ntawm chips kuj tso cai rau kev siv cov txheej txheem zoo tshaj plaws ntawm cov txheej txheem sib txawv, xws li kev sib cais i / o block los ntawm kev ua cov blocks, ntxiv txhim kho kev ua tau zoo, ntxiv txhim kho kev ua haujlwm.
Ntxiv nrog rau kev ua tau zoo suav sib sau (HPC), lwm yam kev lag luam kuj yuav cia siab kom ua tiav kev loj hlob los ntawm kev saws cov thev naus laus zis siab. Nyob rau hauv 5G thiab 6g cov haujlwm, kev hloov kho tshiab xws li ntim cov kav hlau txais xov thiab txiav-ntug nti ntawm wireless nkag mus network (khiav) architectures. Qhov chaw lawv nyob hauv yuav muaj kuj tseem yuav muaj txiaj ntsig, raws li cov thev naus laus zis txhawb nqa kev sib xyaw ua ke thaum muaj kev tswj hwm, kev tswj hwm, thiab cov nqi ua kom zoo.
Cov neeg siv khoom siv hluav taws xob (suav nrog cov smartphones, smr / vr carrument ntawm kev ua cov chaw ntau dua, txawm tias muaj kev taw qhia ntau dua. Advanced Semiconductor Ntim yuav ua lub luag haujlwm tseem ceeb hauv cov qauv no, txawm hais tias cov kev ntim ntim yuav txawv ntawm cov siv hauv HPC.
Lub Sijhawm Post: Kaum-07-2024