ASML, ib lub tuam txhab ua lag luam thoob ntiaj teb hauv kev tsim cov tshuab semiconductor lithography, nyuam qhuav tshaj tawm txog kev tsim cov thev naus laus zis tshiab hu ua extreme ultraviolet (EUV) lithography. Cov thev naus laus zis no yuav ua rau kev tsim cov khoom siv semiconductor zoo dua, ua rau muaj peev xwm tsim cov chips nrog cov yam ntxwv me dua thiab kev ua tau zoo dua.
Lub tshuab EUV lithography tshiab tuaj yeem ua tiav qhov kev daws teeb meem txog li 1.5 nanometers, qhov kev txhim kho zoo dua li cov cuab yeej lithography tam sim no. Qhov kev ua kom raug dua no yuav muaj kev cuam tshuam loj heev rau cov ntaub ntawv ntim khoom semiconductor. Thaum cov chips me dua thiab nyuaj dua, qhov kev thov rau cov kab xev nqa khoom siab, cov kab xev npog, thiab cov reels kom ntseeg tau tias kev thauj mus los thiab khaws cia ntawm cov khoom me me no yuav nce ntxiv.
Peb lub tuam txhab cog lus tias yuav ua raws li cov kev nce qib hauv kev lag luam semiconductor no. Peb yuav txuas ntxiv nqis peev rau kev tshawb fawb thiab kev txhim kho kom tsim cov ntaub ntawv ntim khoom uas tuaj yeem ua tau raws li cov kev cai tshiab uas ASML siv thev naus laus zis lithography tshiab, muab kev txhawb nqa zoo rau cov txheej txheem tsim khoom semiconductor.
Lub sijhawm tshaj tawm: Lub Ob Hlis-17-2025