Kev lag luam ntim khoom thiab kuaj semiconductor thoob ntiaj teb yuav tsum tswj hwm kev loj hlob ruaj khov hauv xyoo 2026, tsav los ntawm kev thov nce ntxiv los ntawm kev txawj ntse cuav, khoom siv hluav taws xob hauv tsheb, thiab kev suav lej ua haujlwm siab.
Cov kws tshuaj ntsuam kev lag luam sau tseg tias cov thev naus laus zis ntim khoom siab heev, suav nrog kev ntim khoom wafer-level (FOWLP), 2.5D thiab 3D, tab tom tseem ceeb zuj zus vim tias cov tuam txhab tsim chip nrhiav kev koom ua ke siab dua thiab cov yam ntxwv me dua.
Kev nqis peev ntau ntxiv rau cov chaw tsim khoom siv semiconductor thoob ntiaj teb kuj txhawb nqa kev nthuav dav ntawm cov khoom siv ntim khoom. Thaum cov khoom siv hluav taws xob ntse dua thiab sib txuas lus ntau dua, qhov xav tau cov kev daws teeb meem ntim khoom txhim khu kev qha thiab raug siab yuav tseem muaj zog thoob plaws cov neeg siv khoom, kev lag luam, thiab tsheb.
Lub sijhawm tshaj tawm: Lub Peb Hlis-02-2026
