Kev lag luam automotive nti tab tom hloov pauv
Tsis ntev los no, pab pawg semiconductor engineering tau sib tham txog cov chips me me, hybrid bonding, thiab cov ntaub ntawv tshiab nrog Michael Kelly, Tus Lwm Thawj Coj ntawm Amkor cov nti me me thiab FCBGA kev koom ua ke. Kuj koom nrog kev sib tham yog ASE tus kws tshawb fawb William Chen, Promex Industries CEO Dick Otte, thiab Sander Roosendaal, R & D Tus Thawj Coj ntawm Synopsys Photonics Solutions. Hauv qab no yog excerpts los ntawm qhov kev sib tham no.
Tau ntau xyoo, txoj kev loj hlob ntawm automotive chips tsis tau ua txoj haujlwm tseem ceeb hauv kev lag luam. Txawm li cas los xij, nrog kev nce ntawm cov tsheb hluav taws xob thiab kev txhim kho cov infotainment siab heev, qhov xwm txheej no tau hloov pauv ntau. Koj pom cov teeb meem dab tsi?
Kelly: High-end ADAS (Advanced Driver Assistance Systems) xav tau cov txheej txheem nrog 5-nanometer txheej txheem lossis me dua kom muaj kev sib tw hauv kev ua lag luam. Thaum koj nkag mus rau cov txheej txheem 5-nanometer, koj yuav tsum xav txog cov nqi wafer, uas ua rau kev ua tib zoo xav txog cov kev daws teeb meem me me, vim nws nyuaj rau tsim cov chips loj ntawm 5-nanometer txheej txheem. Tsis tas li ntawd, yield yog tsawg, uas ua rau cov nqi siab heev. Thaum cuam tshuam nrog 5-nanometer lossis ntau dua cov txheej txheem, cov neeg siv khoom feem ntau xav txog kev xaiv ib feem ntawm 5-nanometer nti es tsis yog siv tag nrho cov nti, thaum nce peev hauv cov txheej txheem ntim khoom. Tej zaum lawv yuav xav tias, "Nws puas yog qhov kev xaiv zoo dua los ua kom tiav qhov kev ua tau zoo li no, tsis yog sim ua kom tiav tag nrho cov haujlwm hauv lub nti loj dua?" Yog li, yog, high-end automotive tuam txhab uas muag yog twv yuav raug hu them rau me me nti technology. Cov tuam txhab lag luam loj hauv kev lag luam tau saib xyuas qhov no. Piv nrog rau kev suav teb, kev lag luam tsheb yuav yog 2 txog 4 xyoo tom qab hauv kev siv cov tshuab me me, tab sis qhov sib txawv rau nws daim ntawv thov hauv kev lag luam tsheb yog qhov tseeb. Kev lag luam tsheb muaj kev ntseeg siab heev, yog li kev ntseeg siab ntawm cov tshuab me me yuav tsum raug pov thawj. Txawm li cas los xij, daim ntawv thov loj ntawm cov cuab yeej siv me me hauv kev ua lag luam tsheb yog qhov tseeb ntawm txoj kev.
Chen: Kuv tsis tau pom muaj teeb meem loj. Kuv xav tias nws yog qhov xav tau ntau dua los kawm thiab nkag siab txog cov ntawv pov thawj cuam tshuam rau qhov tob. Qhov no rov qab mus rau qib metrology. Peb yuav ua li cas thiaj tsim cov pob khoom uas ua tau raws li cov qauv tsheb nruj heev? Tab sis nws yog qhov tseeb tias cov cuab yeej siv tau txuas mus ntxiv.
Muab ntau qhov teeb meem thermal thiab cov teeb meem nyuaj uas cuam tshuam nrog ntau qhov kev tuag, puas yuav muaj cov kev ntsuas kev ntxhov siab tshiab lossis ntau hom kev sim? Tam sim no JEDEC cov qauv puas tuaj yeem npog cov kab ke sib xyaw ua ke?
Chen: Kuv ntseeg tias peb yuav tsum txhim kho cov txheej txheem kuaj mob kom paub meej kom paub meej tias qhov ua tsis tiav. Peb tau sib tham txog kev sib txuas lus metrology nrog kev kuaj mob, thiab peb muaj lub luag haujlwm los xyuas seb yuav ua li cas los tsim cov pob khoom muaj zog dua, siv cov ntaub ntawv zoo dua thiab cov txheej txheem, thiab siv tau.
Kelly: Niaj hnub no, peb tab tom ua cov ntaub ntawv tshawb fawb nrog cov neeg siv khoom, uas tau kawm ib yam dab tsi los ntawm kev ntsuas qhov system, tshwj xeeb tshaj yog ntsuas qhov ntsuas kub hauv kev ntsuas kev ua haujlwm, uas tsis suav nrog hauv kev sim JEDEC. Kev sim JEDEC tsuas yog ntsuas isothermal, suav nrog "kub nce, poob, thiab hloov pauv kub." Txawm li cas los xij, qhov ntsuas kub ntawm cov pob khoom tiag tiag nyob deb ntawm qhov tshwm sim hauv ntiaj teb tiag. Ntau thiab ntau cov neeg siv khoom xav ua qhov kev sim-theem thaum ntxov vim lawv nkag siab qhov xwm txheej no, txawm tias tsis yog txhua tus paub txog nws. Simulation thev naus laus zis kuj tseem ua lub luag haujlwm ntawm no. Yog tias ib tus neeg txawj ntse hauv thermal-mechanical ua ke simulation, kev txheeb xyuas cov teeb meem yuav yooj yim dua vim lawv paub tias yam twg yuav tsum tsom rau thaum kuaj. System-level testing thiab simulation technology ntxiv rau ib leeg. Txawm li cas los xij, qhov sib txawv no tseem nyob hauv nws cov theem pib.
Puas muaj ntau qhov teeb meem thermal los daws ntawm cov thev naus laus zis paub tab dua li yav dhau los?
Otte: Yog lawm, tab sis ob peb xyoos dhau los, cov teeb meem kev sib koom tes tau dhau los ua qhov tseem ceeb. Peb pom 5,000 txog 10,000 tus ncej tooj liab ntawm lub nti, qhov sib nrug ntawm 50 microns thiab 127 microns sib nrug. Yog tias koj ua tib zoo tshuaj xyuas cov ntaub ntawv cuam tshuam, koj yuav pom tias muab cov ncej tooj liab no rau ntawm lub substrate thiab ua haujlwm cua sov, txias, thiab rov ua haujlwm rov qab yuav tsum tau ua tiav txog ib feem ntawm ib puas txhiab coplanarity precision. Ib feem ntawm ib puas txhiab precision yog zoo li nrhiav ib tug hniav ntawm nyom nyob rau hauv ntev ntawm ib tug football teb. Peb tau yuav qee cov cuab yeej ua haujlwm siab Keyence los ntsuas qhov flatness ntawm nti thiab substrate. Tau kawg, cov lus nug tom qab yog yuav ua li cas los tswj qhov tshwm sim warping thaum lub sij hawm reflow soldering? Qhov no yog qhov teeb meem tseem ceeb uas yuav tsum tau daws.
Chen: Kuv nco qab kev sib tham txog Ponte Vecchio, qhov chaw uas lawv siv cov khoom kub kub rau kev sib dhos tsis yog vim li cas kev ua haujlwm.
Muab hais tias tag nrho cov circuits nyob ze tseem muaj cov teeb meem thermal, yuav ua li cas photonics muab tso rau hauv qhov no?
Roosendaal: Kev simulation cua sov yuav tsum tau ua rau txhua yam, thiab kev tshem tawm cov zaus kuj tseem tsim nyog vim tias cov teeb liab nkag mus yog cov teeb liab siab. Yog li ntawd, cov teeb meem xws li impedance txuam thiab cov av tsim nyog yuav tsum tau daws. Nws tuaj yeem muaj qhov kub thiab txias gradients, uas tej zaum yuav muaj nyob rau hauv qhov tuag nws tus kheej los yog ntawm qhov peb hu ua "E" tuag (hluav taws xob tuag) thiab "P" tuag (photon tuag). Kuv xav paub yog tias peb xav tau delve tob rau hauv cov yam ntxwv thermal ntawm cov nplaum.
Qhov no ua rau muaj kev sib tham txog kev sib txuas cov ntaub ntawv, lawv cov kev xaiv, thiab kev ruaj ntseg nyob rau lub sijhawm. Nws yog pov thawj tias hybrid bonding tshuab tau siv nyob rau hauv lub ntiaj teb tiag tiag, tab sis nws tseem tsis tau siv rau ntau lawm. Lub xeev tam sim no ntawm cov tshuab no yog dab tsi?
Kelly: Tag nrho cov tog neeg hauv cov saw hlau tau them nyiaj rau hybrid bonding technology. Tam sim no, cov thev naus laus zis no feem ntau yog coj los ntawm cov chaw tsim khoom, tab sis OSAT (Outsourced Semiconductor Assembly thiab Test) cov tuam txhab kuj tseem kawm nws cov ntawv thov kev lag luam. Classic tooj liab hybrid dielectric bonding Cheebtsam tau dhau mus ntev validation. Yog tias kev huv huv tuaj yeem tswj tau, cov txheej txheem no tuaj yeem tsim cov khoom muaj zog heev. Txawm li cas los xij, nws muaj qhov yuav tsum tau ua kom huv huv heev, thiab cov cuab yeej siv peev nyiaj yog siab heev. Peb tau ntsib kev sim ua ntej hauv AMD's Ryzen cov khoom lag luam, qhov twg feem ntau ntawm SRAM siv tooj liab hybrid bonding tshuab. Txawm li cas los xij, kuv tsis tau pom ntau tus neeg siv khoom siv cov cuab yeej no. Txawm hais tias nws yog nyob rau ntawm txoj kev siv thev naus laus zis ntawm ntau lub tuam txhab, nws zoo li tias nws yuav siv sijhawm ob peb xyoos ntxiv rau cov khoom siv sib txuas kom tau raws li kev xav tau ntawm kev huv huv. Yog tias nws tuaj yeem siv rau hauv ib puag ncig ntawm lub Hoobkas nrog kev ua kom huv si me ntsis dua li cov wafer fab, thiab yog tias tus nqi qis dua tuaj yeem ua tiav, tej zaum qhov tshuab no yuav tau txais kev saib xyuas ntau dua.
Chen: Raws li kuv cov txheeb cais, tsawg kawg 37 cov ntaub ntawv ntawm kev sib koom ua ke yuav raug nthuav tawm ntawm 2024 ECTC lub rooj sib tham. Qhov no yog cov txheej txheem uas yuav tsum tau muaj kev txawj ntse ntau thiab koom nrog ntau qhov kev ua haujlwm zoo thaum sib dhos. Yog li no thev naus laus zis yuav pom kev siv dav dav. Tseem muaj qee qhov kev thov, tab sis yav tom ntej, nws yuav dhau los ua ntau dua thoob plaws ntau qhov chaw.
Thaum koj hais txog "kev ua haujlwm zoo," koj puas xav tau kev nqis peev nyiaj txiag tseem ceeb?
Chen: Tau kawg, nws suav nrog lub sijhawm thiab kev txawj ntse. Kev ua haujlwm no yuav tsum muaj ib puag ncig huv si, uas yuav tsum tau nqis peev nyiaj txiag. Nws tseem xav tau cov khoom siv sib xws, uas zoo ib yam yuav tsum tau txais nyiaj txiag. Yog li qhov no tsis yog tsuas yog cov nqi ua haujlwm xwb tab sis kuj tseem nqis peev hauv cov chaw.
Kelly: Nyob rau hauv rooj plaub uas muaj qhov sib nrug ntawm 15 microns lossis loj dua, muaj kev txaus siab tseem ceeb hauv kev siv tooj liab ncej wafer-rau-wafer tshuab. Qhov zoo tshaj plaws, cov wafers yog tiaj tus, thiab cov nti qhov ntau thiab tsawg tsis loj heev, tso cai rau kev ua haujlwm zoo rau qee qhov sib txawv. Thaum qhov no nthuav tawm qee qhov kev sib tw, nws tsis tshua kim dua li kev cog lus rau tooj liab hybrid bonding tshuab. Txawm li cas los xij, yog tias qhov xav tau qhov tseeb yog 10 microns lossis qis dua, qhov xwm txheej hloov. Cov tuam txhab siv chip stacking tshuab yuav ua tiav ib tus lej micron qhov sib nrug, xws li 4 lossis 5 microns, thiab tsis muaj lwm txoj hauv kev. Yog li ntawd, cov cuab yeej cuab tam yuav inevitably tsim. Txawm li cas los xij, cov thev naus laus zis uas twb muaj lawm kuj tseem txhim kho tsis tu ncua. Yog li tam sim no peb tab tom tsom mus rau cov kev txwv uas cov ncej tooj liab tuaj yeem txuas ntxiv thiab seb lub tshuab no puas yuav kav ntev txaus rau cov neeg siv khoom kom ncua tag nrho cov qauv tsim thiab "kev tsim nyog" kev nqis peev hauv qhov tseeb tooj liab hybrid bonding technology.
Chen: Peb tsuas yog siv cov thev naus laus zis cuam tshuam thaum muaj kev thov.
Puas muaj ntau qhov kev txhim kho tshiab hauv epoxy molding compound teb tam sim no?
Kelly: Moulding compounds tau hloov pauv tseem ceeb. Lawv CTE (coefficient ntawm thermal expansion) tau txo qis heev, ua rau lawv zoo dua rau cov kev siv cuam tshuam los ntawm qhov kev xav ntawm lub siab.
Otte: Rov qab mus rau peb qhov kev sib tham dhau los, muaj pes tsawg tus semiconductor chips tam sim no tsim nrog 1 lossis 2 micron qhov sib nrug?
Kelly: Ib qho piv txwv tseem ceeb.
Chen: Tej zaum tsawg dua 1%.
Otte: Yog li thev naus laus zis peb tab tom tham tsis yog qhov tseem ceeb. Nws tsis yog nyob rau theem kev tshawb fawb, raws li cov tuam txhab ua lag luam tau siv cov thev naus laus zis no tiag tiag, tab sis nws raug nqi thiab muaj txiaj ntsig tsawg.
Kelly: Qhov no feem ntau yog siv rau hauv kev ua haujlwm siab. Niaj hnub no, nws yog siv tsis tau tsuas yog nyob rau hauv cov ntaub ntawv chaw tab sis kuj nyob rau hauv high-end PCs thiab txawm ib co handheld pab kiag li lawm. Txawm hais tias cov cuab yeej no me me, lawv tseem muaj kev ua haujlwm siab. Txawm li cas los xij, hauv cov ntsiab lus dav dav ntawm cov txheej txheem thiab CMOS daim ntawv thov, nws qhov kev faib ua feem tseem me me. Rau cov tuam txhab chip zoo tib yam, tsis tas yuav siv cov thev naus laus zis no.
Otte: Yog vim li cas nws thiaj li xav tsis thoob thaum pom cov tshuab no nkag mus rau hauv kev lag luam tsheb. Tsheb tsis xav tau chips kom me me heev. Lawv tuaj yeem nyob twj ywm ntawm 20 lossis 40 nanometer txheej txheem, raws li tus nqi ntawm ib lub transistor hauv semiconductors qis tshaj ntawm cov txheej txheem no.
Kelly: Txawm li cas los xij, cov kev xav tau ntawm ADAS lossis kev tsav tsheb tsis muaj zog yog tib yam li cov AI PCs lossis cov khoom siv zoo sib xws. Yog li ntawd, kev lag luam automotive yuav tsum tau nqis peev rau hauv cov thev naus laus zis no.
Yog tias lub voj voog khoom yog tsib xyoos, tuaj yeem siv cov thev naus laus zis tshiab txuas ntxiv kom zoo dua rau tsib xyoos ntxiv?
Kelly: Qhov ntawd yog qhov tsim nyog heev. Kev lag luam tsheb muaj lwm lub kaum sab xis. Xav txog tej yam yooj yim servo controllers los yog kuj yooj yim analog li uas muaj nyob rau hauv 20 xyoo thiab yog heev tsawg-nqi. Lawv siv cov chips me me. Cov neeg nyob hauv kev lag luam tsheb xav txuas ntxiv siv cov khoom no. Lawv tsuas yog xav nqis peev hauv cov khoom siv high-end suav nrog cov chips me me thiab tejzaum nws ua ke nrog cov nqi qis analog chips, flash nco, thiab RF chips. Rau lawv, cov qauv me me ua rau muaj kev nkag siab zoo vim tias lawv tuaj yeem khaws tau ntau tus nqi qis, ruaj khov, cov khoom qub qub. Lawv tsis xav hloov cov khoom no lossis xav tau. Tom qab ntawd, lawv tsuas yog yuav tsum tau ntxiv lub siab kawg 5-nanometer lossis 3-nanometer me nti kom ua tiav cov haujlwm ntawm ADAS feem. Qhov tseeb, lawv tab tom siv ntau hom chips me me hauv ib yam khoom. Tsis zoo li PC thiab suav teb, kev lag luam tsheb muaj ntau yam kev siv ntau yam.
Chen: Ntxiv mus, cov chips no tsis tas yuav tsum tau nruab ib sab ntawm lub cav, yog li cov xwm txheej ib puag ncig zoo dua.
Kelly: Qhov kub ntawm ib puag ncig hauv tsheb yog qhov siab heev. Yog li ntawd, txawm hais tias lub nti lub zog tsis yog siab tshwj xeeb, kev lag luam tsheb yuav tsum tau nqis peev qee cov nyiaj hauv kev tswj xyuas thermal zoo thiab tej zaum yuav txawm xav txog kev siv indium TIM (cov ntaub ntawv thermal interface) vim hais tias ib puag ncig tej yam kev mob hnyav heev.
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