SAN JOSE - Samsung Electronics Co. yuav nthuav tawm peb-dimensional (3D) ntim cov kev pabcuam rau lub cim xeeb siab bandwidth (HBM) hauv lub xyoo, cov thev naus laus zis yuav tsum tau nthuav tawm rau lub tshuab txawj ntse nti tus qauv thib rau HBM4 txog xyoo 2025, raws li lub tuam txhab thiab kev lag luam qhov chaw.
Thaum Lub Rau Hli 20, lub ntiaj teb lub cim xeeb loj tshaj plaws chipmaker tau nthuav tawm nws cov txheej txheem ntim khoom tshiab tshiab thiab cov phiaj xwm kev pabcuam ntawm Samsung Foundry Forum 2024 tuav hauv San Jose, California.
Nws yog thawj zaug Samsung tso tawm 3D ntim tshuab rau HBM chips hauv kev tshwm sim rau pej xeem.Tam sim no, HBM chips tau ntim nrog 2.5D thev naus laus zis.
Nws tuaj txog ob lub lis piam tom qab Nvidia tus tsim thiab Tus Thawj Coj Jensen Huang tau nthuav tawm cov qauv tshiab ntawm nws lub platform AI Rubin thaum hais lus hauv Taiwan.
HBM4 yuav zoo li yuav muab tso rau hauv Nvidia tus qauv Rubin GPU tshiab xav tias yuav ntaus lub khw hauv 2026.
VERTICAL CONNECTION
Samsung qhov tseeb ntim tshuab nta HBM chips stacked vertically nyob rau sab saum toj ntawm GPU kom ntxiv ceev cov ntaub ntawv kawm thiab inference ua, ib tug tshuab suav hais tias yog ib tug game changer nyob rau hauv lub lag luam AI nti loj hlob sai.
Tam sim no, HBM chips yog kab rov tav txuas nrog GPU ntawm silicon interposer raws li 2.5D ntim tshuab.
Los ntawm kev sib piv, 3D ntim tsis tas yuav tsum muaj silicon interposer, los yog nyias substrate uas zaum ntawm chips kom lawv sib txuas lus thiab ua hauj lwm ua ke.Samsung dubs nws cov tshiab ntim tshuab li SAINT-D, luv luv rau Samsung Advanced Interconnection Technology-D.
TURNKEY SERVICE
Lub tuam txhab South Kauslim tau nkag siab muab 3D HBM ntim rau ntawm lub hauv paus turnkey.
Txhawm rau ua li ntawd, nws pab pawg ntim qib siab yuav txuas txuas txuas HBM chips uas tsim los ntawm nws lub cim xeeb kev lag luam nrog GPUs sib sau ua ke rau cov tuam txhab tsis muaj txiaj ntsig los ntawm nws lub tsev tsim khoom.
"Kev ntim 3D txo qis kev siv hluav taws xob thiab kev ua haujlwm qeeb, txhim kho cov khoom siv hluav taws xob zoo ntawm semiconductor chips," said Samsung Electronics official.Nyob rau hauv 2027, Samsung npaj yuav qhia tag nrho-nyob rau hauv-ib heterogeneous integration technology uas muaj xws li kho qhov muag ntsiab uas ua rau kom cov ntaub ntawv kis ceev ntawm semiconductors mus rau hauv ib tug unified pob ntawm AI accelerators.
Raws li kev xav tau loj zuj zus rau cov khoom siv hluav taws xob tsawg, cov chips ua haujlwm siab, HBM tau kwv yees kom nce 30% ntawm DRAM kev lag luam hauv 2025 los ntawm 21% hauv 2024, raws li TrendForce, lub tuam txhab tshawb fawb Taiwan.
MGI Kev tshawb fawb kwv yees lub lag luam ntim khoom siab heev, suav nrog 3D ntim, kom loj hlob mus txog $ 80 nphom los ntawm 2032, piv nrog $ 34.5 nphom hauv 2023.
Post lub sij hawm: Jun-10-2024