SAN JOSE -- Samsung Electronics Co. yuav tso tawm cov kev pabcuam ntim khoom peb-seem (3D) rau lub cim xeeb siab-bandwidth (HBM) hauv ib xyoos, ib qho thev naus laus zis uas xav tias yuav raug qhia rau lub cim xeeb txawj ntse thib rau HBM4 uas yuav tshwm sim hauv xyoo 2025, raws li lub tuam txhab thiab cov peev txheej kev lag luam.
Thaum Lub Rau Hli 20, lub tuam txhab tsim cov chip nco loj tshaj plaws hauv ntiaj teb tau tshaj tawm nws cov thev naus laus zis ntim khoom tshiab thiab cov phiaj xwm kev pabcuam ntawm Samsung Foundry Forum 2024 uas tau muaj nyob hauv San Jose, California.
Nws yog thawj zaug uas Samsung tso tawm cov thev naus laus zis ntim khoom 3D rau HBM chips hauv kev tshwm sim rau pej xeem. Tam sim no, cov chips HBM feem ntau yog ntim nrog cov thev naus laus zis 2.5D.
Nws tau tshwm sim li ob lub lis piam tom qab Nvidia tus neeg koom ua ke thiab CEO Jensen Huang tau tshaj tawm cov qauv tshiab ntawm nws lub platform AI Rubin thaum lub sijhawm hais lus hauv Taiwan.
HBM4 yuav raug muab tso rau hauv Nvidia tus qauv Rubin GPU tshiab uas yuav tawm hauv khw xyoo 2026.
KEV TXUAS NRUAB NRAB
Samsung cov thev naus laus zis ntim khoom tshiab tshaj plaws muaj cov chips HBM uas muab tso rau saum GPU kom ua kom nrawm dua kev kawm cov ntaub ntawv thiab kev ua cov txheej txheem inference, ib qho thev naus laus zis suav tias yog qhov hloov pauv loj hauv kev lag luam AI chip uas loj hlob sai.
Tam sim no, HBM chips txuas nrog GPU ntawm silicon interposer hauv qab 2.5D packaging technology.
Piv txwv li, 3D ntim khoom tsis xav tau ib lub silicon interposer, lossis ib lub substrate nyias nyias uas nyob nruab nrab ntawm cov chips kom lawv sib txuas lus thiab ua haujlwm ua ke. Samsung hu nws cov thev naus laus zis ntim khoom tshiab ua SAINT-D, luv rau Samsung Advanced Interconnection Technology-D.
KEV PAB CUAM TXOG KEV UA HAUJ LWM
Lub tuam txhab Kauslim Teb Sab Qab Teb tau nkag siab tias muab cov ntim khoom 3D HBM raws li qhov xav tau.
Yuav ua li ntawd, nws pab neeg ntim khoom siab heev yuav txuas cov HBM chips tsim tawm ntawm nws lub chaw ua lag luam nco nrog GPUs sib sau ua ke rau cov tuam txhab fabless los ntawm nws lub chaw tsim khoom.
"Kev ntim khoom 3D txo qhov kev siv hluav taws xob thiab kev ua qeeb, txhim kho qhov zoo ntawm cov teeb liab hluav taws xob ntawm cov chips semiconductor," tus thawj coj ntawm Samsung Electronics tau hais. Xyoo 2027, Samsung npaj yuav qhia txog kev siv tshuab sib xyaw ua ke uas suav nrog cov khoom siv kho qhov muag uas ua rau qhov ceev ntawm kev xa cov ntaub ntawv ntawm cov semiconductors nce ntxiv mus rau hauv ib pob khoom ntawm AI accelerators.
Raws li qhov kev thov loj hlob rau cov chips uas siv hluav taws xob tsawg, kev ua haujlwm siab, HBM kwv yees tias yuav ua rau 30% ntawm kev lag luam DRAM hauv xyoo 2025 los ntawm 21% hauv xyoo 2024, raws li TrendForce, lub tuam txhab tshawb fawb Taiwanese.
MGI Research kwv yees tias kev lag luam ntim khoom siv thev naus laus zis, suav nrog kev ntim khoom 3D, yuav loj hlob mus txog $ 80 billion txog xyoo 2032, piv rau $ 34.5 billion hauv xyoo 2023.
Lub sijhawm tshaj tawm: Lub Rau Hli-10-2024