San Jose - Samsung Electronics Co. yuav pib peb-seem (HBM) tsis pub dhau lub xyoo xaus rau HBM4 vim muaj 2025, raws li lub tuam txhab thiab cov chaw lag luam.
Lub Rau Hli 20, lub ntiaj teb loj tshaj plaws chipmaker unveiled nws qhov tseeb ntim tshuab thiab kev pabcuam hauv SAMSUng Foundzor forum 2024 tuav hauv San Jose, California.
Nws yog thawj thawj zaug Samsung los tso tawm cov thev naus laus zis 3D ntim tshuab rau HBM cov chips hauv HBM hauv ib qho xwm txheej pej xeem. Tam sim no, HBM chips tau ntim ib zaug nrog 2.5D thev naus laus zis.
Nws tuaj txog li ob lub lis piam tom qab tus thawj coj thiab tus thawj coj Hensuive Jensen Huben Huben Huben Architecture ntawm nws lub Platform Rubin thaum hais lus hauv Taiwan.
HBM4 yuav muaj nyob rau hauv NVIDIA lub tshiab Rubin GPU qauv yuav tsum tau tsoo lub khw hauv 2026.
Ntsug txuas
Samsung qhov tseeb ntim techne nta hbm chips stacked ntsug ntsug nyob rau sab saum toj kev kawm thiab kev ua haujlwm ntxiv, thev naus laus zis hauv kev ua lag luam khiav ceev.
Tam sim no, HBM chips yog kab rov tav txuas nrog GPU ntawm cov khoom cua silicon hauv qab ntawm 2.5D ntim tshuab.
Los ntawm kev sib piv, 3D ntim tsis tas yuav tsum muaj Silicon tusterter, lossis nyias substrate uas yog cov chips tso cai rau lawv sib txuas lus thiab ua haujlwm ua ke. Samsung Dubs Nws cov cuab yeej siv tshuab tshiab zoo li Saint-D, luv rau samsung Advances Interconpection Technology-D.
Kev pabcuam turnkey
Lub tuam txhab Kaus Lim Kauslim yog to taub txog kev ntim 3D HBM ntim rau ntawm lub nraub qaum Turnkey.
Txhawm rau ua li ntawd, nws pab pawg siab kawg yuav ntsug kev sib cais hbm ua rau nws lub cim xeeb kev sib cais los ntawm cov tuam txhab FABLESS los ntawm nws cov khoom siv.
"3D ntim txo kev siv fais fab thiab kev ua haujlwm qeeb, txhim kho cov cim hluav taws xob ntawm cov cim hluav taws xob soob," SAMSUNG Electronics official. Hauv 2027, Samsung npaj los qhia txhua yam heterogeneous thev naus laus zis uas ua rau cov ntaub ntawv kho kho tshiab uas ua kom muaj kev sib xyaw ua ke ntawm cov khoom siv hluav taws xob ib puag ncig ntawm Ai Accelsators.
Nyob rau hauv txoj kab nrog kev cog lus rau cov khoom siv tsawg, HBM yog npaj ua lag luam hauv 2025 ntawm 2125 raws li Trendforce, ib lub tuam txhab Taiwanese.
MGI Kev Tshawb Fawb Kev Ua Lag Luam Kev Lag Luam Advanced Kev Lag Luam, suav nrog 3D ntim, kom loj hlob mus rau $ 80 txhiab nyiaj los ntawm 2032, piv nrog $ 34.5 billion hauv 2023.
Lub Sijhawm Post: Jun-10-2024