Thaum lub Cuaj Hlis 13, 2024, Resonac tshaj tawm tias lawv yuav tsim lub tsev tshiab rau SiC (silicon carbide) wafers rau cov khoom siv fais fab semiconductors ntawm nws lub Hoobkas Yamagata hauv Higashine City, Yamagata Prefecture. Kev ua tiav yuav tsum tau ua tiav rau lub quarter thib peb ntawm xyoo 2025.
Lub chaw tshiab no yuav nyob hauv Yamagata Plant ntawm nws lub tuam txhab me, Resonac Hard Disk, thiab yuav muaj thaj chaw tsim kho ntawm 5,832 square meters. Nws yuav tsim cov SiC wafers (substrates thiab epitaxy). Thaum Lub Rau Hli 2023, Resonac tau txais daim ntawv pov thawj los ntawm Ministry of Economy, Trade thiab Industry ua ib feem ntawm txoj kev npaj khoom siv rau cov ntaub ntawv tseem ceeb uas tau teev tseg hauv Economic Security Promotion Act, tshwj xeeb rau cov ntaub ntawv semiconductor (SiC wafers). Txoj kev npaj khoom siv uas tau pom zoo los ntawm Ministry of Economy, Trade thiab Industry xav tau kev nqis peev ntawm 30.9 billion yen los txhawb kom muaj peev xwm tsim SiC wafer ntawm cov hauv paus hauv Oyama City, Tochigi Prefecture; Hikone City, Shiga Prefecture; Higashine City, Yamagata Prefecture; thiab Ichihara City, Chiba Prefecture, nrog rau kev pab nyiaj txog li 10.3 billion yen.
Lub tswv yim yog pib muab SiC wafers (substrates) rau Oyama City, Hikone City, thiab Higashine City thaum lub Plaub Hlis 2027, nrog rau lub peev xwm tsim khoom txhua xyoo ntawm 117,000 daim (sib npaug rau 6 nti). Kev muab SiC epitaxial wafers rau Ichihara City thiab Higashine City tau teem sijhawm pib thaum lub Tsib Hlis 2027, nrog rau lub peev xwm txhua xyoo ntawm 288,000 daim (tsis hloov pauv).
Thaum lub Cuaj Hlis 12, 2024, lub tuam txhab tau ua ib qho kev ua koob tsheej qhib kev tsim kho ntawm qhov chaw npaj ua haujlwm ntawm Yamagata Plant.
Lub sijhawm tshaj tawm: Cuaj hlis-16-2024